全部分类
面向工业物联网的时间敏感网络解决方案
所属分类:
时间敏感网络
服务热线:
18612628057
咨询邮箱:
riley_chow@jsjtzg.com
面向工业物联网的时间敏感网络解决方案
应用详情
面向工业物联网的时间敏感网络解决方案
LS1021A-TSN-RD
产品详情
框图
时间敏感网络
支持的器件
处理器和微控制器
K2x / KS2x USB
- K22_120: Kinetis® K22-120 MHz,高性价比,全速USB微控制器(MCU),基于Arm® Cortex®-M4内核
接口
汽车以太网交换机
- SJA1105TEL: 5端口AVB & TSN汽车以太网交换机
具有灵活数据传输速率的CAN
- TJA1052IT: 电气隔离的高速CAN收发器
Features
LS1021A
- The LS1021A processor is built on Layerscape architecture, the industry's first software-aware, core-agnostic networking architecture to offer unprecedented efficiency and scale.
K22
- 100 MHz USB MCU family supports cost-sensitive applications requiring low power flexibility and processing efficiency.
SJA1105T
- Offers a flexible solution for implementing modular and cost-optimized Electronic Control Units (ECUs) using Ethernet as the backbone for control applications.
TJA1052I
- The TJA1052i is specifically targeted at Electric Vehicles (EV) and Hybrid Electric Vehicles (HEV), where galvanic isolation barriers are needed between the high- and low-voltage parts.
Functionality
- Netconf/YANG model for Qbv protocol
- 802.1AS endpoint mode for TSN switch
- Industrial IoT support for LS1028A – BLE click board
- LS1028 Baremetal ENETC support
- LS1028 ENETC Xenomai RTNET support
文档
-
用户指南
Open Industrial User Guide - Rev1.11
-
用户指南
Industrial IoT Baremetal Framework Developer Guide Rev1.10
-
简介
Layerscape LS1021A TSN Reference Design Fact Sheet
-
白皮书
New Technologies Upgrade Industrial Networks
-
-
用户指南
Industrial IoT Baremetal Framework Developer Guide - Rev1.11
-
用户指南
Open Industrial Linux User Guide v1.10
-
白皮书
Smarter Infrastructure for a Smarter World White Paper
-
白皮书
Four Technologies for Industrial 4.0
-
设计文件
-
印刷电路板与原理图
LS1021ATSN Build of Materials
-
印刷电路板与原理图
LS1021ATSN Gerber File
-
印刷电路板与原理图
LS1021ATSN Printed Circuit Board
-
软件
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.6) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.2) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.4) SDK
-
BSP、驱动程序和中间件
Real-time Edge 软件
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.11) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.9) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.3) SDK
-
仿真器、探测器和编程器
MCU-Link Pro硬件调试器
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.8) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.3.1) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.7) SDK
-
BSP、驱动程序和中间件
Industrial Linux (Rev 1.1) SDK
20多年专注半导体
为国内各行业广大用户提供高品质的NXP半导体产品
SINCE 1997
为您量身定制解决方案
![公众号 公众号](http://img203.yun300.cn/img/WD_erweima.jpg?tenantId=280778&viewType=1&k=1691045585000)
众赢免费计划软件国际版公众号